Description

BGA-integrated-circuit-chip-IC

BGA (Ball Grid Array Package), Spherical bumps are formed on the back surface of the printed substrate to replace the lead, and the LSI chip is mounted on the front surface of the PCB board, and then sealed by a molding resin or a potting method, the pins can exceed 200.

The package body can be made smaller than QFP and the BGA does not have to worry about pin deformation problems like QFP.

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